Infineon Technologies IRF9952

Infineon Technologies IRF9952 electronic component product image

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Manufacturer No
IRF9952
Package
8-SOIC (0.154", 3.90mm Width)
Packaging
Tube
Description
MOSFET N/P-CH 30V 3.5A/2.3A 8SO
Detailed Description
Mosfet Array 30V 3.5A, 2.3A 2W Surface Mount 8-SO
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
HEXFET®
Packaging
Tube
Technology
MOSFET (Metal Oxide)
FET Feature
Logic Level Gate
Power - Max
2W
Manufacturer
Infineon Technologies
Configuration
N and P-Channel
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Vgs(th) (Max) @ Id
1V @ 250µA
Base Product Number
IRF995
Operating Temperature
-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs
100mOhm @ 2.2A, 10V
Supplier Device Package
8-SO
Gate Charge (Qg) (Max) @ Vgs
14nC @ 10V
Drain to Source Voltage (Vdss)
30V
Input Capacitance (Ciss) (Max) @ Vds
190pF @ 15V
Current - Continuous Drain (Id) @ 25°C
3.5A, 2.3A
AttributeValue
SeriesHEXFET®
PackagingTube
TechnologyMOSFET (Metal Oxide)
FET FeatureLogic Level Gate
Power - Max2W
ManufacturerInfineon Technologies
ConfigurationN and P-Channel
Mounting TypeSurface Mount
Package / Case8-SOIC (0.154", 3.90mm Width)
Vgs(th) (Max) @ Id1V @ 250µA
Base Product NumberIRF995
Operating Temperature-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs100mOhm @ 2.2A, 10V
Supplier Device Package8-SO
Gate Charge (Qg) (Max) @ Vgs14nC @ 10V
Drain to Source Voltage (Vdss)30V
Input Capacitance (Ciss) (Max) @ Vds190pF @ 15V
Current - Continuous Drain (Id) @ 25°C3.5A, 2.3A

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping