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Infineon Technologies IRF8113

Infineon Technologies IRF8113 electronic component product image

Image is only for reference

Manufacturer No
IRF8113
Package
8-SOIC (0.154", 3.90mm Width)
Packaging
Tube
Description
MOSFET N-CH 30V 17.2A 8SO
Detailed Description
N-Channel 30 V 17.2A (Ta) 2.5W (Ta) Surface Mount 8-SO
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Infineon Technologies
Grade
-
Series
HEXFET®
FET Type
N-Channel
Packaging
Tube
Vgs (Max)
±20V
Technology
MOSFET (Metal Oxide)
FET Feature
-
Mounting Type
Surface Mount
Qualification
-
Package / Case
8-SOIC (0.154", 3.90mm Width)
Vgs(th) (Max) @ Id
2.2V @ 250µA
Operating Temperature
-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs
5.6mOhm @ 17.2A, 10V
Power Dissipation (Max)
2.5W (Ta)
Supplier Device Package
8-SO
Gate Charge (Qg) (Max) @ Vgs
36 nC @ 4.5 V
Drain to Source Voltage (Vdss)
30 V
Input Capacitance (Ciss) (Max) @ Vds
2910 pF @ 15 V
Drive Voltage (Max Rds On, Min Rds On)
4.5V, 10V
Current - Continuous Drain (Id) @ 25°C
17.2A (Ta)
AttributeValue
MfrInfineon Technologies
Grade-
SeriesHEXFET®
FET TypeN-Channel
PackagingTube
Vgs (Max)±20V
TechnologyMOSFET (Metal Oxide)
FET Feature-
Mounting TypeSurface Mount
Qualification-
Package / Case8-SOIC (0.154", 3.90mm Width)
Vgs(th) (Max) @ Id2.2V @ 250µA
Operating Temperature-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs5.6mOhm @ 17.2A, 10V
Power Dissipation (Max)2.5W (Ta)
Supplier Device Package8-SO
Gate Charge (Qg) (Max) @ Vgs36 nC @ 4.5 V
Drain to Source Voltage (Vdss)30 V
Input Capacitance (Ciss) (Max) @ Vds2910 pF @ 15 V
Drive Voltage (Max Rds On, Min Rds On)4.5V, 10V
Current - Continuous Drain (Id) @ 25°C17.2A (Ta)

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