Infineon Technologies IRF7342PBF
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| Attribute | Value |
|---|---|
| HTS | COMPONENTS |
| PPAP | No |
| EU RoHS | Compliant |
| Category | Power MOSFET |
| Material | Si |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tube |
| Pin Count | 8 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 8 |
| Availability | No Stock Available |
| Channel Mode | Enhancement |
| Channel Type | P |
| Configuration | Dual Dual Drain |
| Package Width | 4(Max) |
| Package Height | 1.5(Max) |
| Package Length | 5(Max) |
| Supplier Package | SOIC |
| Standard Package Name | SO |
| Typical Fall Time (ns) | 22 |
| Typical Rise Time (ns) | 10 |
| Number of Elements per Chip | 2 |
| Maximum Power Dissipation (mW) | 2000 |
| Typical Gate Charge @ 10V (nC) | 26 |
| Typical Gate Charge @ Vgs (nC) | 26@10V |
| Maximum Gate-Source Voltage (V) | ±20 |
| Typical Output Capacitance (pF) | 210 |
| Typical Turn-On Delay Time (ns) | 14 |
| Maximum Drain-Source Voltage (V) | 55 |
| Typical Turn-Off Delay Time (ns) | 43 |
| Typical Gate to Drain Charge (nC) | 8.4 |
| Maximum Gate Threshold Voltage (V) | 1(Min) |
| Typical Gate to Source Charge (nC) | 3 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Continuous Drain Current (A) | 3.4 |
| Typical Input Capacitance @ Vds (pF) | 690@25V |
| Typical Reverse Recovery Charge (nC) | 85 |
| Maximum Drain-Source Resistance (mOhm) | 105@10V |
| Typical Drain-Source Resistance @ 25°C (mOhm) | 95@10V|[email protected] |
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Packaging Process
