Infineon Technologies FF4MR12W2M1HB70BPSA1

Infineon Technologies FF4MR12W2M1HB70BPSA1 electronic component product image

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Manufacturer No
FF4MR12W2M1HB70BPSA1
Package
Module
Packaging
Tray
Description
LOW POWER EASY
Detailed Description
Mosfet Array 1200V (1.2kV) 200A Chassis Mount
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Grade
-
Series
CoolSiC™
Packaging
Tray
Technology
Silicon Carbide (SiC)
FET Feature
-
Power - Max
-
Manufacturer
Infineon Technologies
Configuration
2 N-Channel (Half Bridge)
Mounting Type
Chassis Mount
Qualification
-
Package / Case
Module
Vgs(th) (Max) @ Id
5.15V @ 80mA
Operating Temperature
-40°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs
4mOhm @ 200A, 18V
Supplier Device Package
-
Gate Charge (Qg) (Max) @ Vgs
594nC @ 18V
Drain to Source Voltage (Vdss)
1200V (1.2kV)
Input Capacitance (Ciss) (Max) @ Vds
17600pF @ 800V
Current - Continuous Drain (Id) @ 25°C
200A
AttributeValue
Grade-
SeriesCoolSiC™
PackagingTray
TechnologySilicon Carbide (SiC)
FET Feature-
Power - Max-
ManufacturerInfineon Technologies
Configuration2 N-Channel (Half Bridge)
Mounting TypeChassis Mount
Qualification-
Package / CaseModule
Vgs(th) (Max) @ Id5.15V @ 80mA
Operating Temperature-40°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs4mOhm @ 200A, 18V
Supplier Device Package-
Gate Charge (Qg) (Max) @ Vgs594nC @ 18V
Drain to Source Voltage (Vdss)1200V (1.2kV)
Input Capacitance (Ciss) (Max) @ Vds17600pF @ 800V
Current - Continuous Drain (Id) @ 25°C200A

Purchase & Inquiry

Placing an Order

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Payment Options

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RFQ (Request for Quote)

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Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping