Infineon Technologies BFP843FH6327XTSA1

Infineon Technologies BFP843FH6327XTSA1 electronic component product image

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Manufacturer No
BFP843FH6327XTSA1
Package
4-SMD, Flat Leads
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
RF TRANS NPN 2.25V PG-TSFP-4-1
Detailed Description
RF Transistor NPN 2.25V 55mA 125mW Surface Mount PG-TSFP-4-1
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Gain
13.5dB ~ 25dB
Series
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Power - Max
125mW
Manufacturer
Infineon Technologies
Mounting Type
Surface Mount
Package / Case
4-SMD, Flat Leads
Transistor Type
NPN
Base Product Number
BFP843
Operating Temperature
150°C (TJ)
Frequency - Transition
-
Supplier Device Package
PG-TSFP-4-1
Noise Figure (dB Typ @ f)
0.8dB ~ 1.7dB @ 450MHz ~ 10GHz
Current - Collector (Ic) (Max)
55mA
DC Current Gain (hFE) (Min) @ Ic, Vce
150 @ 15mA, 1.8V
Voltage - Collector Emitter Breakdown (Max)
2.25V
AttributeValue
Gain13.5dB ~ 25dB
Series-
PackagingTape & Reel (TR); Cut Tape (CT)
Power - Max125mW
ManufacturerInfineon Technologies
Mounting TypeSurface Mount
Package / Case4-SMD, Flat Leads
Transistor TypeNPN
Base Product NumberBFP843
Operating Temperature150°C (TJ)
Frequency - Transition-
Supplier Device PackagePG-TSFP-4-1
Noise Figure (dB Typ @ f)0.8dB ~ 1.7dB @ 450MHz ~ 10GHz
Current - Collector (Ic) (Max)55mA
DC Current Gain (hFE) (Min) @ Ic, Vce150 @ 15mA, 1.8V
Voltage - Collector Emitter Breakdown (Max)2.25V

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping