10-13 NOV 2026 · Munich, Germany

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Infineon Technologies BAS3005S-02LRHE6327

Infineon Technologies BAS3005S-02LRHE6327 electronic component product image

Image is only for reference

Manufacturer No
BAS3005S-02LRHE6327
Package
SOD-882
Packaging
Bulk
Description
DIODE SCHOTT 30V 500MA PGTSLP217
Detailed Description
Diode 30 V 500mA Surface Mount PG-TSLP-2-17
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Infineon Technologies
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
BAS
Packaging
Bulk
Technology
Schottky
Mounting Type
Surface Mount
Package / Case
SOD-882
Capacitance @ Vr, F
15pF @ 5V, 1MHz
Supplier Device Package
PG-TSLP-2-17
Current - Reverse Leakage @ Vr
300 µA @ 30 V
Voltage - DC Reverse (Vr) (Max)
30 V
Current - Average Rectified (Io)
500mA
Operating Temperature - Junction
150°C
Voltage - Forward (Vf) (Max) @ If
500 mV @ 500 mA
AttributeValue
MfrInfineon Technologies
SpeedFast Recovery =< 500ns, > 200mA (Io)
SeriesBAS
PackagingBulk
TechnologySchottky
Mounting TypeSurface Mount
Package / CaseSOD-882
Capacitance @ Vr, F15pF @ 5V, 1MHz
Supplier Device PackagePG-TSLP-2-17
Current - Reverse Leakage @ Vr300 µA @ 30 V
Voltage - DC Reverse (Vr) (Max)30 V
Current - Average Rectified (Io)500mA
Operating Temperature - Junction150°C
Voltage - Forward (Vf) (Max) @ If500 mV @ 500 mA

Purchase & Inquiry

Placing an Order

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Payment Options

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RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process