10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Hologram, Inc. SIM-ST-MFF2

Hologram, Inc. SIM-ST-MFF2 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
SIM-ST-MFF2
Availability
In Stock
Packaging
Tape & Reel (TR)
Description
GLOBAL IOT EMBEDDED SIM CHIP
Detailed Description
2G, 3G, 4G LTE IOT ESIM (MFF2) SIM Card
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Class
-
Format
ESIM (MFF2)
Memory
-
Series
-
Features
-
Packaging
Tape & Reel (TR)
Manufacturer
Hologram, Inc.
Core Processor
-
Carrier Network
-
Size / Dimension
5mm L x 6mm W x 0.82mm H
Network Technology
2G, 3G, 4G LTE IOT
Operating Temperature
-
AttributeValue
Class-
FormatESIM (MFF2)
Memory-
Series-
Features-
PackagingTape & Reel (TR)
ManufacturerHologram, Inc.
Core Processor-
Carrier Network-
Size / Dimension5mm L x 6mm W x 0.82mm H
Network Technology2G, 3G, 4G LTE IOT
Operating Temperature-

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Packaging Process