Himax HX6537-A09TDIG

Himax HX6537-A09TDIG electronic component product image

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Manufacturer
Manufacturer No
HX6537-A09TDIG
Availability
In Stock
Package
72-VFQFN Exposed Pad
Packaging
Tray
Description
IC MCU 2MB FLASH 72QFN
Detailed Description
ARC EM9D - Microcontroller IC 32-Bit 400MHz 320KB (320K x 8) SRAM 72-QFN (8x8)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Himax
Speed
400MHz
Series
-
RAM Size
2M x 8
Core Size
32-Bit
Packaging
Tray
EEPROM Size
-
Peripherals
Brown-out Detect/Reset, DMA, I2S, POR, PWM, Sensor I/F, WDT
Connectivity
I2C, PDM, SPI, UART/USART
Mounting Type
Surface Mount
Number of I/O
9
Core Processor
ARC EM9D
Package / Case
72-VFQFN Exposed Pad
Data Converters
A/D 4x12b
Oscillator Type
Internal
Base Product Number
HX6537
Program Memory Size
320KB (320K x 8)
Program Memory Type
SRAM
Operating Temperature
-
Supplier Device Package
72-QFN (8x8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
AttributeValue
MfrHimax
Speed400MHz
Series-
RAM Size2M x 8
Core Size32-Bit
PackagingTray
EEPROM Size-
PeripheralsBrown-out Detect/Reset, DMA, I2S, POR, PWM, Sensor I/F, WDT
ConnectivityI2C, PDM, SPI, UART/USART
Mounting TypeSurface Mount
Number of I/O9
Core ProcessorARC EM9D
Package / Case72-VFQFN Exposed Pad
Data ConvertersA/D 4x12b
Oscillator TypeInternal
Base Product NumberHX6537
Program Memory Size320KB (320K x 8)
Program Memory TypeSRAM
Operating Temperature-
Supplier Device Package72-QFN (8x8)
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V

Purchase & Inquiry

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping