10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Goertek Microelectronics Inc. SPL07-006

Goertek Microelectronics Inc. SPL07-006 electronic component product image

Image is only for reference

Manufacturer No
SPL07-006
Package
10-VFLGA Module
Packaging
Tape & Reel (TR)
Description
SENSOR DIG PRESS ABS W/TEMP LGA
Detailed Description
Pressure Sensor 4.35PSI ~ 15.95PSI (30kPa ~ 110kPa) Absolute 24 b 10-VFLGA Module
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Output
24 b
Series
-
Accuracy
±0.5%
Features
Standby Mode
Packaging
Tape & Reel (TR)
Port Size
-
Port Style
No Port
Output Type
I2C, SPI
Applications
Board Mount
Manufacturer
Goertek Microelectronics Inc.
Mounting Type
Surface Mount
Pressure Type
Absolute
Package / Case
10-VFLGA Module
Maximum Pressure
-
Voltage - Supply
1.7V ~ 3.6V
Termination Style
-
Operating Pressure
4.35PSI ~ 15.95PSI (30kPa ~ 110kPa)
Operating Temperature
-40°C ~ 85°C
Supplier Device Package
10-LGA (2x2)
AttributeValue
Output24 b
Series-
Accuracy±0.5%
FeaturesStandby Mode
PackagingTape & Reel (TR)
Port Size-
Port StyleNo Port
Output TypeI2C, SPI
ApplicationsBoard Mount
ManufacturerGoertek Microelectronics Inc.
Mounting TypeSurface Mount
Pressure TypeAbsolute
Package / Case10-VFLGA Module
Maximum Pressure-
Voltage - Supply1.7V ~ 3.6V
Termination Style-
Operating Pressure4.35PSI ~ 15.95PSI (30kPa ~ 110kPa)
Operating Temperature-40°C ~ 85°C
Supplier Device Package10-LGA (2x2)

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Packaging Process