GaNPower GPI65030DFN

Images are for reference only

Manufacturer

GaNPower

Manufacturer No

GPI65030DFN

Package

Die

Packaging

Tape & Reel (TR)

Description

GANFET N-CH 650V 30A DFN8X8

Detailed Description

N-Channel 650 V 30A Surface Mount Die

Datasheet

GPI65030DFN

Payment

Delivery

Mfr

GaNPower

Grade

-

Series

-

FET Type

N-Channel

Packaging

Tape & Reel (TR)

Vgs (Max)

+7.5V, -12V

Technology

GaNFET (Gallium Nitride)

FET Feature

-

Mounting Type

Surface Mount

Qualification

-

Package / Case

Die

Vgs(th) (Max) @ Id

1.2V @ 3.5mA

Operating Temperature

-55°C ~ 150°C (TJ)

Power Dissipation (Max)

-

Supplier Device Package

Die

Gate Charge (Qg) (Max) @ Vgs

5.8 nC @ 6 V

Drain to Source Voltage (Vdss)

650 V

Input Capacitance (Ciss) (Max) @ Vds

241 pF @ 400 V

Drive Voltage (Max Rds On, Min Rds On)

6V

Current - Continuous Drain (Id) @ 25°C

30A

Attribute	Value
Mfr	GaNPower
Grade	-
Series	-
FET Type	N-Channel
Packaging	Tape & Reel (TR)
Vgs (Max)	+7.5V, -12V
Technology	GaNFET (Gallium Nitride)
FET Feature	-
Mounting Type	Surface Mount
Qualification	-
Package / Case	Die
Vgs(th) (Max) @ Id	1.2V @ 3.5mA
Operating Temperature	-55°C ~ 150°C (TJ)
Power Dissipation (Max)	-
Supplier Device Package	Die
Gate Charge (Qg) (Max) @ Vgs	5.8 nC @ 6 V
Drain to Source Voltage (Vdss)	650 V
Input Capacitance (Ciss) (Max) @ Vds	241 pF @ 400 V
Drive Voltage (Max Rds On, Min Rds On)	6V
Current - Continuous Drain (Id) @ 25°C	30A

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Packaging Process