Flexxon Pte Ltd FEMC032GBB-T740

Flexxon Pte Ltd FEMC032GBB-T740 electronic component product image

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Manufacturer
Manufacturer No
FEMC032GBB-T740
Quantity
79,774
Availability
In Stock
Package
153-VFBGA
Packaging
Tray
Description
IC FLSH 256GBIT EMMC 5.1 153FBGA
Detailed Description
FLASH - NAND (TLC) Memory IC 256Gbit eMMC_5.1 200 MHz 153-FBGA (11.5x13)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Flexxon Pte Ltd
Series
XTRA VIII
Packaging
Tray
Technology
FLASH - NAND (TLC)
Memory Size
256Gbit
Memory Type
Non-Volatile
Memory Format
FLASH
Mounting Type
Surface Mount
Package / Case
153-VFBGA
Clock Frequency
200 MHz
Memory Interface
eMMC_5.1
Voltage - Supply
2.7V ~ 3.6V
Base Product Number
FEMC032
Memory Organization
32G x 8
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 105°C
Supplier Device Package
153-FBGA (11.5x13)
Write Cycle Time - Word, Page
-
AttributeValue
MfrFlexxon Pte Ltd
SeriesXTRA VIII
PackagingTray
TechnologyFLASH - NAND (TLC)
Memory Size256Gbit
Memory TypeNon-Volatile
Memory FormatFLASH
Mounting TypeSurface Mount
Package / Case153-VFBGA
Clock Frequency200 MHz
Memory InterfaceeMMC_5.1
Voltage - Supply2.7V ~ 3.6V
Base Product NumberFEMC032
Memory Organization32G x 8
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 105°C
Supplier Device Package153-FBGA (11.5x13)
Write Cycle Time - Word, Page-

Purchase & Inquiry

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping