10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Everspin Technologies Inc. MR3A16ACMA35R

Everspin Technologies Inc. MR3A16ACMA35R electronic component product image

Image is only for reference

Manufacturer No
MR3A16ACMA35R
Availability
In Stock
Package
FBGA
Packaging
Tape and Reel
Description
MRAM 8Mbit Parallel Interface 3.3V 48-Pin FBGA T/R
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8542.32.00.71
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Pin Count
48
Automotive
No
PCB changed
48
Availability
No Stock Available
Organization
512Kx16
Package Width
10
Interface Type
Parallel
Package Height
1
Package Length
10
Supplier Package
FBGA
Chip Density (bit)
8M
Density Range (bit)
>=8M
Data Bus Width (bit)
16
Max. Access Time (ns)
35
Standard Package Name
BGA
Manufacturer Lead Time
26 weeks
Operating Current (mA)
180
Supplier Temperature Grade
Industrial
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
3.6
Minimum Operating Supply Voltage (V)
3
Typical Operating Supply Voltage (V)
3.3
AttributeValue
HTS8542.32.00.71
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count48
AutomotiveNo
PCB changed48
AvailabilityNo Stock Available
Organization512Kx16
Package Width10
Interface TypeParallel
Package Height1
Package Length10
Supplier PackageFBGA
Chip Density (bit)8M
Density Range (bit)>=8M
Data Bus Width (bit)16
Max. Access Time (ns)35
Standard Package NameBGA
Manufacturer Lead Time26 weeks
Operating Current (mA)180
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)3
Typical Operating Supply Voltage (V)3.3

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Packaging Process