Enfis IS25LE256E-RMLE-TY

Enfis IS25LE256E-RMLE-TY electronic component product image

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Manufacturer
Manufacturer No
IS25LE256E-RMLE-TY
Quantity
78,103
Availability
In Stock
Package
16-SOIC (0.295", 7.50mm Width)
Packaging
Tray
Description
IC FLASH 256MB SPI/QUAD 16SOIC
Detailed Description
FLASH - NOR Memory IC 256Mbit SPI - Quad I/O, QPI, DTR 166 MHz 16-SOIC
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Enfis
Series
-
Packaging
Tray
Technology
FLASH - NOR
Memory Size
256Mbit
Memory Type
Non-Volatile
Memory Format
FLASH
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.295", 7.50mm Width)
Clock Frequency
166 MHz
Memory Interface
SPI - Quad I/O, QPI, DTR
Voltage - Supply
2.3V ~ 3.6V
Base Product Number
IS25LE256
Memory Organization
32M x 8
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 105°C (TA)
Supplier Device Package
16-SOIC
Write Cycle Time - Word, Page
50µs, 2ms
AttributeValue
MfrEnfis
Series-
PackagingTray
TechnologyFLASH - NOR
Memory Size256Mbit
Memory TypeNon-Volatile
Memory FormatFLASH
Mounting TypeSurface Mount
Package / Case16-SOIC (0.295", 7.50mm Width)
Clock Frequency166 MHz
Memory InterfaceSPI - Quad I/O, QPI, DTR
Voltage - Supply2.3V ~ 3.6V
Base Product NumberIS25LE256
Memory Organization32M x 8
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 105°C (TA)
Supplier Device Package16-SOIC
Write Cycle Time - Word, Page50µs, 2ms

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping