EM Microelectronic EM9305BS001WW31

EM Microelectronic EM9305BS001WW31 electronic component product image

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Manufacturer
Manufacturer No
EM9305BS001WW31
Package
Die
Packaging
Tape & Reel (TR)
Description
BLUETOOTH LE IC, WAFER
Detailed Description
IC RF TxRx + MCU Bluetooth Bluetooth v5.4 2.4GHz Die
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
EM Microelectronic
GPIO
12
Type
TxRx + MCU
Grade
-
Series
-
Protocol
Bluetooth v5.4
Frequency
2.4GHz
Packaging
Tape & Reel (TR)
Modulation
-
Memory Size
512kB Flash, 64kB RAM
Sensitivity
-94dBm
Mounting Type
Surface Mount
Qualification
-
Package / Case
Die
Power - Output
6dBm
Data Rate (Max)
2Mbps
Voltage - Supply
1.73V ~ 3.6V, 4.4V ~ 5.25V
Serial Interfaces
ADC, GPIO, I2C, I2S, SPI, UART, USB
RF Family/Standard
Bluetooth
Base Product Number
EM9305
Current - Receiving
3.1mA
Operating Temperature
-40°C ~ 85°C
Current - Transmitting
3.4mA
Supplier Device Package
Wafer
AttributeValue
MfrEM Microelectronic
GPIO12
TypeTxRx + MCU
Grade-
Series-
ProtocolBluetooth v5.4
Frequency2.4GHz
PackagingTape & Reel (TR)
Modulation-
Memory Size512kB Flash, 64kB RAM
Sensitivity-94dBm
Mounting TypeSurface Mount
Qualification-
Package / CaseDie
Power - Output6dBm
Data Rate (Max)2Mbps
Voltage - Supply1.73V ~ 3.6V, 4.4V ~ 5.25V
Serial InterfacesADC, GPIO, I2C, I2S, SPI, UART, USB
RF Family/StandardBluetooth
Base Product NumberEM9305
Current - Receiving3.1mA
Operating Temperature-40°C ~ 85°C
Current - Transmitting3.4mA
Supplier Device PackageWafer

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping