10-13 NOV 2026 · Munich, Germany

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eInfochips EIC - Q600 -220

eInfochips EIC - Q600 -220 electronic component product image

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Manufacturer
Manufacturer No
EIC - Q600 -220
Description
EIC-Q600-200 System on Module - SOM Development Kit 1700MHz CPU 1GB RAM 4GB eMMC Flash Android 5.0/Linux Kernel 3.19
Detailed Description
This development kit EIC - Q600 - 220 embedded system development board from eInfochips is great for adding microprocessor-based functionality to your electronic circuit. It has a maximum clock speed of 1700 MHz. Its emmc program memory is 4GB.
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8473.30.11.80
I2C
1
SPI
1
USB
3
GPIO
20
Type
Development Kit
Linux
Linux Kernel 3.19
RS232
1
Android
Android 5.0
EU RoHS
Supplier Unconfirmed
Ethernet
1
RAM Size
1GB
ECCN (US)
5A992c.
Availability
In Stock
Display Type
LCD
JTAG Support
No
Daughter Cards
No
Wi-Fi Location
On Board
Audio Interfaces
Yes
Supported Device
EIC-Q600-200
Display Interface
HDMI
Operating Systems
Android 5.0|Linux Kernel 3.19
PC Card Interface
SD
Bluetooth Location
On Board
Program Memory Size
4GB
Program Memory Type
eMMC Flash
Manufacturer Lead Time
99 weeks
Main Program Memory Type
Flash
Supported Device Technology
System on Module - SOM
AttributeValue
HTS8473.30.11.80
I2C1
SPI1
USB3
GPIO20
TypeDevelopment Kit
LinuxLinux Kernel 3.19
RS2321
AndroidAndroid 5.0
EU RoHSSupplier Unconfirmed
Ethernet1
RAM Size1GB
ECCN (US)5A992c.
AvailabilityIn Stock
Display TypeLCD
JTAG SupportNo
Daughter CardsNo
Wi-Fi LocationOn Board
Audio InterfacesYes
Supported DeviceEIC-Q600-200
Display InterfaceHDMI
Operating SystemsAndroid 5.0|Linux Kernel 3.19
PC Card InterfaceSD
Bluetooth LocationOn Board
Program Memory Size4GB
Program Memory TypeeMMC Flash
Manufacturer Lead Time99 weeks
Main Program Memory TypeFlash
Supported Device TechnologySystem on Module - SOM

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Packaging Process