10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

EI Sensor Technologies EPLB32F503

EI Sensor Technologies EPLB32F503 electronic component product image

Image is only for reference

Manufacturer No
EPLB32F503
Package
Bead, Epoxy
Packaging
Bulk
Description
THERMISTOR, EPOXY, 50K 1%, ENAME
Detailed Description
NTC Thermistor 50k Bead, Epoxy
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
B0/50
-
B25/50
3950K
B25/75
-
B25/85
4007K
Series
EPLB
B25/100
-
Packaging
Bulk
Manufacturer
EI Sensor Technologies
Mounting Type
Free Hanging
Package / Case
Bead, Epoxy
B Value Tolerance
-
Length - Lead Wire
2.56" (65.02mm)
Resistance Tolerance
±1%
Operating Temperature
-30°C ~ 100°C
Resistance in Ohms @ 25°C
50k
AttributeValue
B0/50-
B25/503950K
B25/75-
B25/854007K
SeriesEPLB
B25/100-
PackagingBulk
ManufacturerEI Sensor Technologies
Mounting TypeFree Hanging
Package / CaseBead, Epoxy
B Value Tolerance-
Length - Lead Wire2.56" (65.02mm)
Resistance Tolerance±1%
Operating Temperature-30°C ~ 100°C
Resistance in Ohms @ 25°C50k

Purchase & Inquiry

Placing an Order

You can place an order with FIXCHIPS without having to register or create an account.

Payment Options

To make payment more convenient, we support multiple payment methods in USD, including PayPal, credit cards, and wire transfer.

RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process