Diodes Incorporated PI6C10810HEX-2017
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8542.39.00.90 |
| PPAP | No |
| Type | Fanout Buffer |
| Fanout | 1:10 |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 20 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 20 |
| Availability | No Stock Available |
| Package Width | 5.3 |
| Package Height | 1.75 |
| Package Length | 7.2 |
| Supplier Package | SSOP |
| Input Logic Level | LVCMOS|LVTTL |
| Maximum Duty Cycle | 60% |
| Output Logic Level | LVCMOS|LVTTL |
| Standard Package Name | SO |
| Number of Outputs per Chip | 10 |
| Supplier Temperature Grade | Industrial |
| Maximum Input Frequency (MHz) | 250 |
| Maximum Quiescent Current (mA) | 16(Typ) |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Absolute Propagation Delay Time (ns) | 6 |
| Maximum Operating Supply Voltage (V) | 2.7 |
| Minimum Operating Supply Voltage (V) | 1.1 |
| Typical Operating Supply Voltage (V) | 1.2|1.5|1.8|2.5 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | [email protected] to 1.3V|[email protected] to 1.6V|[email protected] to 1.95V|[email protected] to 2.7V |
Purchase & Inquiry
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Packaging Process
