10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Diodes Incorporated PI3EQX1002B1ZLEX

Diodes Incorporated PI3EQX1002B1ZLEX electronic component product image

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Manufacturer No
PI3EQX1002B1ZLEX
Date Code
21+
Quantity
12,400
Availability
In Stock
Package
30-WFQFN Exposed Pad
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
USB3 EQX W-QFN2545-30
Detailed Description
Buffer, ReDriver 1 Channel 10Gbps 30-TQFN (2.5x4.5)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Type
Buffer, ReDriver
Input
CML
Output
CML
Series
ReDriver™
Packaging
Tape & Reel (TR); Cut Tape (CT)
Delay Time
2.0ns
Applications
USB 3.1
Manufacturer
Diodes Incorporated
Mounting Type
Surface Mount
Package / Case
30-WFQFN Exposed Pad
Data Rate (Max)
10Gbps
Current - Supply
-
Voltage - Supply
3V ~ 3.6V
Number of Channels
1
Base Product Number
PI3EQX1002
Signal Conditioning
Input Equalization
Operating Temperature
0°C ~ 70°C
Supplier Device Package
30-TQFN (2.5x4.5)
AttributeValue
TypeBuffer, ReDriver
InputCML
OutputCML
SeriesReDriver™
PackagingTape & Reel (TR); Cut Tape (CT)
Delay Time2.0ns
ApplicationsUSB 3.1
ManufacturerDiodes Incorporated
Mounting TypeSurface Mount
Package / Case30-WFQFN Exposed Pad
Data Rate (Max)10Gbps
Current - Supply-
Voltage - Supply3V ~ 3.6V
Number of Channels1
Base Product NumberPI3EQX1002
Signal ConditioningInput Equalization
Operating Temperature0°C ~ 70°C
Supplier Device Package30-TQFN (2.5x4.5)

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