10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

DACO Semiconductor MBRH20020

DACO Semiconductor MBRH20020 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
MBRH20020
Package
Module
Packaging
Tray
Description
DIODE SCHOTTKY 20V 200A D67
Detailed Description
Diode 20 V 200A Chassis Mount D-67 HALF-PAK
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
DACO Semiconductor
Grade
-
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Packaging
Tray
Technology
Schottky
Mounting Type
Chassis Mount
Qualification
-
Package / Case
Module
Capacitance @ Vr, F
-
Supplier Device Package
D-67 HALF-PAK
Current - Reverse Leakage @ Vr
1 mA @ 20 V
Voltage - DC Reverse (Vr) (Max)
20 V
Current - Average Rectified (Io)
200A
Operating Temperature - Junction
-55°C ~ 150°C
Voltage - Forward (Vf) (Max) @ If
700 mV @ 200 A
AttributeValue
MfrDACO Semiconductor
Grade-
SpeedFast Recovery =< 500ns, > 200mA (Io)
Series-
PackagingTray
TechnologySchottky
Mounting TypeChassis Mount
Qualification-
Package / CaseModule
Capacitance @ Vr, F-
Supplier Device PackageD-67 HALF-PAK
Current - Reverse Leakage @ Vr1 mA @ 20 V
Voltage - DC Reverse (Vr) (Max)20 V
Current - Average Rectified (Io)200A
Operating Temperature - Junction-55°C ~ 150°C
Voltage - Forward (Vf) (Max) @ If700 mV @ 200 A

Purchase & Inquiry

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process