Chip Quik Inc. WS991LT35T4

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Manufacturer

Chip Quik Inc.

Manufacturer No

WS991LT35T4

Packaging

Bulk

Description

THERMALLY STABLE SOLDER PASTE WS

Detailed Description

Water Soluble Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (34.869g)

Datasheet

WS991LT35T4

Payment

Delivery

Form

Syringe, 1.23 oz (34.869g)

Type

Solder Paste

Series

CHIPQUIK®

Weight

-

Process

-

Diameter

-

Flux Type

Water Soluble

Mesh Type

4

Packaging

Bulk

Shelf Life

12 Months

Wire Gauge

-

Composition

Bi57.6Sn42Ag0.4 (57.6/42/0.4)

Manufacturer

Chip Quik Inc.

Melting Point

280°F (138°C)

Shipping Info

-

Shelf Life Start

Date of Manufacture

Storage/Refrigeration Temperature

37°F ~ 77°F (3°C ~ 25°C)

Attribute	Value
Form	Syringe, 1.23 oz (34.869g)
Type	Solder Paste
Series	CHIPQUIK®
Weight	-
Process	-
Diameter	-
Flux Type	Water Soluble
Mesh Type	4
Packaging	Bulk
Shelf Life	12 Months
Wire Gauge	-
Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Manufacturer	Chip Quik Inc.
Melting Point	280°F (138°C)
Shipping Info	-
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	37°F ~ 77°F (3°C ~ 25°C)

Purchase & Inquiry

Placing an Order

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Payment Options

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RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process