Chip Quik Inc. TS391LT

Images are for reference only

Manufacturer

Chip Quik Inc.

Manufacturer No

TS391LT

Packaging

Bulk

Description

THERMALLY STABLE SOLDER PASTE NO

Detailed Description

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc

Datasheet

TS391LT

Payment

Delivery

Form

Syringe, 0.53 oz (15g), 5cc

Type

Solder Paste

Series

-

Process

Lead Free

Diameter

-

Flux Type

No-Clean

Mesh Type

4

Packaging

Bulk

Shelf Life

12 Months

Wire Gauge

-

Composition

Bi57.6Sn42Ag0.4 (57.6/42/0.4)

Manufacturer

Chip Quik Inc.

Melting Point

281°F (138°C)

Shipping Info

-

Shelf Life Start

Date of Manufacture

Base Product Number

TS391L

Storage/Refrigeration Temperature

68°F ~ 77°F (20°C ~ 25°C)

Attribute	Value
Form	Syringe, 0.53 oz (15g), 5cc
Type	Solder Paste
Series	-
Process	Lead Free
Diameter	-
Flux Type	No-Clean
Mesh Type	4
Packaging	Bulk
Shelf Life	12 Months
Wire Gauge	-
Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Manufacturer	Chip Quik Inc.
Melting Point	281°F (138°C)
Shipping Info	-
Shelf Life Start	Date of Manufacture
Base Product Number	TS391L
Storage/Refrigeration Temperature	68°F ~ 77°F (20°C ~ 25°C)

Purchase & Inquiry

Placing an Order

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Payment Options

To make payment more convenient, we support multiple payment methods in USD, including PayPal, credit cards, and wire transfer.

RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process