10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Chip Quik Inc. SBBSM127P

Chip Quik Inc. SBBSM127P electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
SBBSM127P
Packaging
Bulk
Description
BREADBOARD SMD PLATED SMD
Detailed Description
Breadboard, Surface Mount Plated Surface Mount Pads (Square) 0.050" (1.27mm) Grid
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Pitch
0.050" (1.27mm) Grid
Series
Proto-Advantage
Plating
Plated Surface Mount
Material
FR4 Epoxy Glass
Packaging
Bulk
Manufacturer
Chip Quik Inc.
Edge Contacts
-
Hole Diameter
-
Board Thickness
0.063" (1.60mm)
Circuit Pattern
Pads (Square)
Proto Board Type
Breadboard, Surface Mount
Size / Dimension
2.00" L x 2.00" W (50.8mm x 50.8mm)
Base Product Number
SBBSM
AttributeValue
Pitch0.050" (1.27mm) Grid
SeriesProto-Advantage
PlatingPlated Surface Mount
MaterialFR4 Epoxy Glass
PackagingBulk
ManufacturerChip Quik Inc.
Edge Contacts-
Hole Diameter-
Board Thickness0.063" (1.60mm)
Circuit PatternPads (Square)
Proto Board TypeBreadboard, Surface Mount
Size / Dimension2.00" L x 2.00" W (50.8mm x 50.8mm)
Base Product NumberSBBSM

Purchase & Inquiry

Placing an Order

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Payment Options

To make payment more convenient, we support multiple payment methods in USD, including PayPal, credit cards, and wire transfer.

RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process