10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Central Semiconductor Corp CP210-2N4416A-CT

Central Semiconductor Corp CP210-2N4416A-CT electronic component product image

Image is only for reference

Manufacturer No
CP210-2N4416A-CT
Package
Die
Packaging
Tray
Description
JFET N-CH 35V 15MA DIE
Detailed Description
JFET N-Channel 35 V 15 mA Surface Mount Die
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
FET Type
N-Channel
Packaging
Tray
Manufacturer
Central Semiconductor Corp
Mounting Type
Surface Mount
Package / Case
Die
Operating Temperature
-65°C ~ 150°C (TJ)
Supplier Device Package
Die
Current Drain (Id) - Max
15 mA
Drain to Source Voltage (Vdss)
35 V
Voltage - Breakdown (V(BR)GSS)
35 V
Voltage - Cutoff (VGS off) @ Id
2.5 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0)
5 mA @ 20 V
Input Capacitance (Ciss) (Max) @ Vds
4pF @ 15V
AttributeValue
Series-
FET TypeN-Channel
PackagingTray
ManufacturerCentral Semiconductor Corp
Mounting TypeSurface Mount
Package / CaseDie
Operating Temperature-65°C ~ 150°C (TJ)
Supplier Device PackageDie
Current Drain (Id) - Max15 mA
Drain to Source Voltage (Vdss)35 V
Voltage - Breakdown (V(BR)GSS)35 V
Voltage - Cutoff (VGS off) @ Id2.5 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0)5 mA @ 20 V
Input Capacitance (Ciss) (Max) @ Vds4pF @ 15V

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process