10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

CEL PS9122-N-AX

CEL PS9122-N-AX electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
PS9122-N-AX
Package
6-SOIC (0.173", 4.40mm Width), 5 Leads
Packaging
Strip
Description
OPTOISOLTR 3.75KV OPEN COLL 5-SO
Detailed Description
Logic Output Optoisolator 1Mbps Open Collector 3750Vrms 1 Channel 15kV/µs CMTI 5-SO
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
NEPOC
Data Rate
1Mbps
Packaging
Strip
Input Type
DC
Output Type
Open Collector
Manufacturer
CEL
Mounting Type
Surface Mount
Package / Case
6-SOIC (0.173", 4.40mm Width), 5 Leads
Voltage - Supply
2.7V ~ 3.6V
Number of Channels
1
Voltage - Isolation
3750Vrms
Operating Temperature
-40°C ~ 100°C
Inputs - Side 1/Side 2
1/0
Rise / Fall Time (Typ)
60ns, 70ns
Supplier Device Package
5-SO
Current - Output / Channel
20 mA
Voltage - Forward (Vf) (Typ)
1.6V
Current - DC Forward (If) (Max)
25mA
Propagation Delay tpLH / tpHL (Max)
700ns, 500ns
Common Mode Transient Immunity (Min)
15kV/µs
AttributeValue
SeriesNEPOC
Data Rate1Mbps
PackagingStrip
Input TypeDC
Output TypeOpen Collector
ManufacturerCEL
Mounting TypeSurface Mount
Package / Case6-SOIC (0.173", 4.40mm Width), 5 Leads
Voltage - Supply2.7V ~ 3.6V
Number of Channels1
Voltage - Isolation3750Vrms
Operating Temperature-40°C ~ 100°C
Inputs - Side 1/Side 21/0
Rise / Fall Time (Typ)60ns, 70ns
Supplier Device Package5-SO
Current - Output / Channel20 mA
Voltage - Forward (Vf) (Typ)1.6V
Current - DC Forward (If) (Max)25mA
Propagation Delay tpLH / tpHL (Max)700ns, 500ns
Common Mode Transient Immunity (Min)15kV/µs

Purchase & Inquiry

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process