BYTe Semiconductor BY25FQ64ELSIG(R)

BYTe Semiconductor BY25FQ64ELSIG(R) electronic component product image

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Manufacturer
Manufacturer No
BY25FQ64ELSIG(R)
Quantity
76,634
Availability
In Stock
Package
8-SOIC (0.209", 5.30mm Width)
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
64 MBIT, 1.8V (1.65V TO 1.95V),
Detailed Description
FLASH - NOR Memory IC 64Mbit SPI - Quad I/O, QPI 133 MHz 7 ns 8-SOP
Payment
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Delivery
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AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
BYTe Semiconductor
Grade
-
Series
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Technology
FLASH - NOR
Access Time
7 ns
Memory Size
64Mbit
Memory Type
Non-Volatile
Memory Format
FLASH
Mounting Type
Surface Mount
Qualification
-
Package / Case
8-SOIC (0.209", 5.30mm Width)
Clock Frequency
133 MHz
Memory Interface
SPI - Quad I/O, QPI
Voltage - Supply
1.65V ~ 2V
Memory Organization
8M x 8
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
8-SOP
Write Cycle Time - Word, Page
500µs, 2.5ms
AttributeValue
MfrBYTe Semiconductor
Grade-
Series-
PackagingTape & Reel (TR); Cut Tape (CT)
TechnologyFLASH - NOR
Access Time7 ns
Memory Size64Mbit
Memory TypeNon-Volatile
Memory FormatFLASH
Mounting TypeSurface Mount
Qualification-
Package / Case8-SOIC (0.209", 5.30mm Width)
Clock Frequency133 MHz
Memory InterfaceSPI - Quad I/O, QPI
Voltage - Supply1.65V ~ 2V
Memory Organization8M x 8
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package8-SOP
Write Cycle Time - Word, Page500µs, 2.5ms

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping