Broadcom Limited BCM53575B0IFSBG

Broadcom Limited BCM53575B0IFSBG electronic component product image

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Manufacturer
Manufacturer No
BCM53575B0IFSBG
Availability
In Stock
Package
-
Packaging
Tray
Description
24X1G + 4X10G L2 TSN SWITCH
Detailed Description
ARM® Cortex®-A9, ARM® Cortex®-R5 System On Chip (SOC) IC - 1.25GHz
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
1.25GHz
Series
-
RAM Size
-
Packaging
Tray
Flash Size
-
Peripherals
SERDES
Architecture
MPU
Connectivity
ACL, MAC, QSGMII
Manufacturer
Broadcom Limited
Number of I/O
-
Core Processor
ARM® Cortex®-A9, ARM® Cortex®-R5
Package / Case
-
Primary Attributes
-
Operating Temperature
-
Supplier Device Package
-
AttributeValue
Speed1.25GHz
Series-
RAM Size-
PackagingTray
Flash Size-
PeripheralsSERDES
ArchitectureMPU
ConnectivityACL, MAC, QSGMII
ManufacturerBroadcom Limited
Number of I/O-
Core ProcessorARM® Cortex®-A9, ARM® Cortex®-R5
Package / Case-
Primary Attributes-
Operating Temperature-
Supplier Device Package-

Purchase & Inquiry

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping