Boyd Laconia, LLC EA-425-H125-T710

Images are for reference only

Manufacturer

Boyd Laconia, LLC

Manufacturer No

EA-425-H125-T710

Packaging

Bulk

Description

STD,EA-425-H125-T710, CLIP ATTAC

Detailed Description

Heat Sink BGA, FPGA Aluminum Top Mount

Payment

Delivery

Mfr

Boyd Laconia, LLC

Type

Top Mount

Shape

Square, Fins

Width

1.673" (42.50mm)

Length

1.673" (42.50mm)

Series

EA-425

Diameter

-

Material

Aluminum

Packaging

Bulk

Fin Height

0.492" (12.50mm)

Package Cooled

BGA, FPGA

Material Finish

Black Anodized

Attachment Method

Clip

Thermal Resistance @ Natural

24.50°C/W

Power Dissipation @ Temperature Rise

-

Thermal Resistance @ Forced Air Flow

11.40°C/W @ 200 LFM

Attribute	Value
Mfr	Boyd Laconia, LLC
Type	Top Mount
Shape	Square, Fins
Width	1.673" (42.50mm)
Length	1.673" (42.50mm)
Series	EA-425
Diameter	-
Material	Aluminum
Packaging	Bulk
Fin Height	0.492" (12.50mm)
Package Cooled	BGA, FPGA
Material Finish	Black Anodized
Attachment Method	Clip
Thermal Resistance @ Natural	24.50°C/W
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	11.40°C/W @ 200 LFM

Purchase & Inquiry

Placing an Order

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Payment Options

To make payment more convenient, we support multiple payment methods in USD, including PayPal, credit cards, and wire transfer.

RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process