Beacon EmbeddedWorks SDK-W5P-10-2G32GR

Beacon EmbeddedWorks SDK-W5P-10-2G32GR electronic component product image

Images are for reference only

Manufacturer No
SDK-W5P-10-2G32GR
Packaging
Box
Description
ZOOM W5+ DEVELOPMENT KIT
Detailed Description
Snapdragon W5+ Zoom Snapdragon W5+ Snapdragon™ ARM® Cortex®-A53, Cortex®-M55 MPU Embedded Evaluation Board
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Beacon EmbeddedWorks
Note
-
Type
MPU
Series
Snapdragon™
Contents
Board(s), Cable(s), Power Supply, Accessories
Platform
Zoom Snapdragon W5+
Packaging
Box
Mounting Type
Fixed
Core Processor
ARM® Cortex®-A53, Cortex®-M55
Utilized IC / Part
Snapdragon W5+
Interconnect System
-
Suggested Programming Environment
-
AttributeValue
MfrBeacon EmbeddedWorks
Note-
TypeMPU
SeriesSnapdragon™
ContentsBoard(s), Cable(s), Power Supply, Accessories
PlatformZoom Snapdragon W5+
PackagingBox
Mounting TypeFixed
Core ProcessorARM® Cortex®-A53, Cortex®-M55
Utilized IC / PartSnapdragon W5+
Interconnect System-
Suggested Programming Environment-

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping