Analog Devices Inc. MAX5259EEE+
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8542.39.00.40 |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tube |
| Pin Count | 16 |
| Automotive | No |
| Lead Shape | Gull-wing |
| Resolution | 8bit |
| Output Type | Voltage |
| PCB changed | 16 |
| Architecture | Resistor-String |
| Availability | No Stock Available |
| Package Width | 3.89 |
| Converter Type | General Purpose |
| Interface Type | Serial (3-Wire, 4-Wire, SPI, QSPI, Microwire) |
| Package Height | 1.47 |
| Package Length | 4.9 |
| Output Polarity | Unipolar |
| Full Scale Error | ±30mV |
| Supplier Package | QSOP |
| Power Supply Type | Single |
| Voltage Reference | External |
| Process Technology | BiCMOS |
| Standard Package Name | SO |
| Manufacturer Lead Time | 10 weeks |
| Number of DAC Channels | 8 |
| Maximum Settling Time (us) | 7(Typ) |
| Number of Outputs per Chip | 8 |
| Supplier Temperature Grade | Extended |
| Integral Nonlinearity Error | ±1LSB |
| Maximum Power Dissipation (mW) | 667 |
| Minimum Single Supply Voltage (V) | 2.7 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
Purchase & Inquiry
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Packaging Process
