Ampleon USA Inc. BLC9G24XS-170AVY
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| Attribute | Value |
|---|---|
| HTS | 8541.29.00.75 |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 7 |
| PCB changed | 7 |
| Availability | No Stock Available |
| Channel Mode | Enhancement |
| Channel Type | N |
| Maximum VSWR | 10 |
| Configuration | Dual Common Source |
| Package Width | 9.91(Max) |
| Package Height | 4.01(Max) |
| Package Length | 20.7(Max) |
| Supplier Package | DFM |
| Maximum IDSS (uA) | 1.4 |
| Mode of Operation | 1-Carrier W-CDMA|Pulsed CW |
| Process Technology | 0.14um |
| Maximum Frequency (MHz) | 2400 |
| Minimum Frequency (MHz) | 2300 |
| Typical Power Gain (dB) | 15.5 |
| Maximum Output Power (W) | 28(Typ) |
| Number of Elements per Chip | 2 |
| Typical Drain Efficiency (%) | 45 |
| Maximum Gate-Source Voltage (V) | 13 |
| Maximum Drain-Source Voltage (V) | 65 |
| Maximum Gate Threshold Voltage (V) | 2.5 |
| Maximum Operating Temperature (°C) | 225 |
| Minimum Operating Temperature (°C) | -65 |
| Typical Forward Transconductance (S) | 4.56 |
| Maximum Drain-Source Resistance (mOhm) | [email protected] |
| Maximum Gate-Source Leakage Current (nA) | 140 |
Purchase & Inquiry
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Packaging Process
