10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Amphenol Communications Solutions 10026846-201LF

Amphenol Communications Solutions 10026846-201LF electronic component product image

Image is only for reference

Manufacturer No
10026846-201LF
Availability
In Stock
Packaging
Tape and Reel
Description
Conn MEG Array RCP 528 POS 1.27mm Solder ST SMD MEG-ARRAY® T/R
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
PPAP
No
Type
MEG Array
Gender
RCP
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Tradename
MEG-ARRAY®
Automotive
No
Availability
No Stock Available
Number of Rows
12
Body Orientation
Straight
Number of Contacts
528
Product Depth (mm)
18.98
Termination Method
Solder
Product Height (mm)
5.89
Product Length (mm)
60.08
Terminal Pitch (mm)
1.27
Mating Cycle (Cycles)
200
Maximum Voltage Rating
200VAC
Maximum Current Rating (A)
0.45
Insulation Resistance (MOhm)
1288
Maximum Contact Resistance (mOhm)
10
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
AttributeValue
PPAPNo
TypeMEG Array
GenderRCP
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
TradenameMEG-ARRAY®
AutomotiveNo
AvailabilityNo Stock Available
Number of Rows12
Body OrientationStraight
Number of Contacts528
Product Depth (mm)18.98
Termination MethodSolder
Product Height (mm)5.89
Product Length (mm)60.08
Terminal Pitch (mm)1.27
Mating Cycle (Cycles)200
Maximum Voltage Rating200VAC
Maximum Current Rating (A)0.45
Insulation Resistance (MOhm)1288
Maximum Contact Resistance (mOhm)10
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process