10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

AMEC Thermasol MPC222225T

AMEC Thermasol MPC222225T electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
MPC222225T
Packaging
Bulk
Description
CERAMIC HEAT SINK - FLAT TYPE
Detailed Description
Heat Sink Ceramic Top Mount
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
AMEC Thermasol
Type
Top Mount
Shape
Square
Width
0.866" (22.00mm)
Length
0.866" (22.00mm)
Series
MPC
Diameter
-
Material
Ceramic
Packaging
Bulk
Fin Height
-
Package Cooled
-
Material Finish
-
Attachment Method
Adhesive
Thermal Resistance @ Natural
-
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
10.21°C/W @ 100 LFM
AttributeValue
MfrAMEC Thermasol
TypeTop Mount
ShapeSquare
Width0.866" (22.00mm)
Length0.866" (22.00mm)
SeriesMPC
Diameter-
MaterialCeramic
PackagingBulk
Fin Height-
Package Cooled-
Material Finish-
Attachment MethodAdhesive
Thermal Resistance @ Natural-
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow10.21°C/W @ 100 LFM

Purchase & Inquiry

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process