Step1: Product
AMD XCZU5CG-1SFVC784I
Images are for reference only
Manufacturer
Manufacturer No
XCZU5CG-1SFVC784I
Package
784-BFBGA, FCBGA
Packaging
Tray
Description
IC SOC CORTEX-A53 784FCBGA
Detailed Description
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSOC CG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 500MHz, 1.2GHz 784-FCBGA (23x23)
Datasheet
Payment
Delivery
Speed
500MHz, 1.2GHz
Series
Zynq® UltraScale+™ MPSOC CG
RAM Size
256KB
Packaging
Tray
Flash Size
-
Peripherals
DMA, WDT
Architecture
MCU, FPGA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Manufacturer
AMD
Number of I/O
252
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Package / Case
784-BFBGA, FCBGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Base Product Number
XCZU5
Operating Temperature
-40°C ~ 100°C (TJ)
Supplier Device Package
784-FCBGA (23x23)
| Attribute | Value |
|---|---|
| Speed | 500MHz, 1.2GHz |
| Series | Zynq® UltraScale+™ MPSOC CG |
| RAM Size | 256KB |
| Packaging | Tray |
| Flash Size | - |
| Peripherals | DMA, WDT |
| Architecture | MCU, FPGA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Manufacturer | AMD |
| Number of I/O | 252 |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Package / Case | 784-BFBGA, FCBGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| Base Product Number | XCZU5 |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 784-FCBGA (23x23) |
Purchase & Inquiry
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Important Notes
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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.
Packaging Process
Step2: Vacuum Packaging
Step3: Anti-Static Bag
Step4: Package Boxes
Step5: Bar-Code Shipping Tags
Step6: Shipping
