10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

AMD XC7Z030-3FFG676E

AMD XC7Z030-3FFG676E electronic component product image

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Manufacturer
Manufacturer No
XC7Z030-3FFG676E
Date Code
24+
Quantity
2,000
Availability
In Stock
Package
676-BBGA, FCBGA
Packaging
Tray
Description
IC SOC CORTEX-A9 1GHZ 676FCBGA
Detailed Description
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 1GHz 676-FCBGA (27x27)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
1GHz
Series
Zynq®-7000
RAM Size
256KB
Packaging
Tray
Flash Size
-
Peripherals
DMA
Architecture
MCU, FPGA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Manufacturer
AMD
Number of I/O
130
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Package / Case
676-BBGA, FCBGA
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Base Product Number
XC7Z030
Operating Temperature
0°C ~ 100°C (TJ)
Supplier Device Package
676-FCBGA (27x27)
AttributeValue
Speed1GHz
SeriesZynq®-7000
RAM Size256KB
PackagingTray
Flash Size-
PeripheralsDMA
ArchitectureMCU, FPGA
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
ManufacturerAMD
Number of I/O130
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Package / Case676-BBGA, FCBGA
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Base Product NumberXC7Z030
Operating Temperature0°C ~ 100°C (TJ)
Supplier Device Package676-FCBGA (27x27)

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