AMD XC7K325T-2FFG900C

AMD XC7K325T-2FFG900C electronic component product image

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Manufacturer
Manufacturer No
XC7K325T-2FFG900C
Quantity
7
Availability
In Stock
Package
900-BBGA, FCBGA
Packaging
Tray
Description
IC FPGA 500 I/O 900FCBGA
Detailed Description
Kintex®-7 Field Programmable Gate Array (FPGA) IC 500 16404480 326080 900-BBGA, FCBGA
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
AMD
Series
Kintex®-7
Packaging
Tray
Mounting Type
Surface Mount
Number of I/O
500
Package / Case
900-BBGA, FCBGA
Total RAM Bits
16404480
Voltage - Supply
0.97V ~ 1.03V
Base Product Number
XC7K325
Number of LABs/CLBs
25475
DigiKey Programmable
Not Verified
Operating Temperature
0°C ~ 85°C (TJ)
Supplier Device Package
900-FCBGA (31x31)
Number of Logic Elements/Cells
326080
AttributeValue
MfrAMD
SeriesKintex®-7
PackagingTray
Mounting TypeSurface Mount
Number of I/O500
Package / Case900-BBGA, FCBGA
Total RAM Bits16404480
Voltage - Supply0.97V ~ 1.03V
Base Product NumberXC7K325
Number of LABs/CLBs25475
DigiKey ProgrammableNot Verified
Operating Temperature0°C ~ 85°C (TJ)
Supplier Device Package900-FCBGA (31x31)
Number of Logic Elements/Cells326080

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping