AMD XC2S50-6PQG208C

AMD XC2S50-6PQG208C electronic component product image

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Manufacturer
Manufacturer No
XC2S50-6PQG208C
Availability
In Stock
Package
208-BFQFP
Packaging
Tray
Description
IC FPGA 140 I/O 208QFP
Detailed Description
Spartan®-II Field Programmable Gate Array (FPGA) IC 140 32768 1728 208-BFQFP
Payment
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Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
AMD
Series
Spartan®-II
Packaging
Tray
Mounting Type
Surface Mount
Number of I/O
140
Package / Case
208-BFQFP
Total RAM Bits
32768
Number of Gates
50000
Voltage - Supply
2.375V ~ 2.625V
Number of LABs/CLBs
384
DigiKey Programmable
Not Verified
Operating Temperature
0°C ~ 85°C (TJ)
Supplier Device Package
208-PQFP (28x28)
Number of Logic Elements/Cells
1728
AttributeValue
MfrAMD
SeriesSpartan®-II
PackagingTray
Mounting TypeSurface Mount
Number of I/O140
Package / Case208-BFQFP
Total RAM Bits32768
Number of Gates50000
Voltage - Supply2.375V ~ 2.625V
Number of LABs/CLBs384
DigiKey ProgrammableNot Verified
Operating Temperature0°C ~ 85°C (TJ)
Supplier Device Package208-PQFP (28x28)
Number of Logic Elements/Cells1728

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping