10-13 NOV 2026 · Munich, Germany

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Altera AGFB027R24C2I3V

Altera AGFB027R24C2I3V electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
AGFB027R24C2I3V
Package
-
Packaging
Tray
Description
IC FPGA AGILEX-F 2340FBGA
Detailed Description
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point System On Chip (SOC) IC Agilex F FPGA - 2.7M Logic Elements 1.4GHz
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
1.4GHz
Series
Agilex F
RAM Size
256KB
Packaging
Tray
Flash Size
-
Peripherals
DMA, WDT
Architecture
MPU, FPGA
Connectivity
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Manufacturer
Altera
Number of I/O
744
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Package / Case
-
Primary Attributes
FPGA - 2.7M Logic Elements
Operating Temperature
-40°C ~ 100°C (TJ)
Supplier Device Package
-
AttributeValue
Speed1.4GHz
SeriesAgilex F
RAM Size256KB
PackagingTray
Flash Size-
PeripheralsDMA, WDT
ArchitectureMPU, FPGA
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
ManufacturerAltera
Number of I/O744
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Package / Case-
Primary AttributesFPGA - 2.7M Logic Elements
Operating Temperature-40°C ~ 100°C (TJ)
Supplier Device Package-

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