10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Alif Semiconductor AE302F80C1557LE-Y

Alif Semiconductor AE302F80C1557LE-Y electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
AE302F80C1557LE-Y
Package
FBGA
Packaging
Tray
Description
MCU 32-bit ARM Cortex M55 RISC 1.8V 194-Pin FBGA Tray
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
CAN
0
HTS
8542.31.00.25
I2C
5
I2S
5
SPI
5
USB
1
PPAP
Unknown
UART
9
USART
0
EU RoHS
Compliant
Ethernet
1
Mounting
Surface Mount
RAM Size
5.75MB
ECCN (US)
5A002
Packaging
Tray
Pin Count
194
Automotive
Unknown
Lead Shape
Ball
Device Core
ARM Cortex M55
Family Name
Ensemble
PCB changed
194
ADC Channels
18/18/18/4
Availability
In Stock
DAC Channels
2
No. of Timers
16
Package Width
10
Interface Type
Ethernet/I2C/I2S/I3C/SPI/UART/USB
Number of ADCs
4
Number of DACs
1
Number of I/Os
88
Package Height
0.96
Package Length
10
Supplier Package
FBGA
Core Architecture
ARM
ADC Resolution (bit)
12/12/12/24
DAC Resolution (bit)
12
Data Bus Width (bit)
32
Standard Package Name
BGA
Manufacturer Lead Time
16 weeks
Supplier Temperature Grade
Extended
Maximum CPU Frequency (MHz)
400
Instruction Set Architecture
RISC
Maximum Clock Frequency (MHz)
400
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
1.98
Minimum Operating Supply Voltage (V)
1.62
Typical Operating Supply Voltage (V)
1.8
AttributeValue
CAN0
HTS8542.31.00.25
I2C5
I2S5
SPI5
USB1
PPAPUnknown
UART9
USART0
EU RoHSCompliant
Ethernet1
MountingSurface Mount
RAM Size5.75MB
ECCN (US)5A002
PackagingTray
Pin Count194
AutomotiveUnknown
Lead ShapeBall
Device CoreARM Cortex M55
Family NameEnsemble
PCB changed194
ADC Channels18/18/18/4
AvailabilityIn Stock
DAC Channels2
No. of Timers16
Package Width10
Interface TypeEthernet/I2C/I2S/I3C/SPI/UART/USB
Number of ADCs4
Number of DACs1
Number of I/Os88
Package Height0.96
Package Length10
Supplier PackageFBGA
Core ArchitectureARM
ADC Resolution (bit)12/12/12/24
DAC Resolution (bit)12
Data Bus Width (bit)32
Standard Package NameBGA
Manufacturer Lead Time16 weeks
Supplier Temperature GradeExtended
Maximum CPU Frequency (MHz)400
Instruction Set ArchitectureRISC
Maximum Clock Frequency (MHz)400
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.98
Minimum Operating Supply Voltage (V)1.62
Typical Operating Supply Voltage (V)1.8

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Packaging Process