Step1: Product
Advanced Micro Devices GX1-233B-85-1.8
Images are for reference only
Manufacturer
Manufacturer No
GX1-233B-85-1.8
Package
352-BGA Exposed Pad
Packaging
Bulk
Description
IC MPU 233MHZ 352EBGA
Detailed Description
AMD Geode™ GX1 Microprocessor IC - 1 Core 233MHz 352-EBGA (35x35)
Datasheet
Payment
Delivery
USB
USB (2)
SATA
-
Speed
233MHz
Series
-
Ethernet
-
Packaging
Bulk
Manufacturer
Advanced Micro Devices
Mounting Type
Surface Mount
Voltage - I/O
3.3V
Core Processor
AMD Geode™ GX1
Package / Case
352-BGA Exposed Pad
RAM Controllers
-
Co-Processors/DSP
-
Security Features
-
Additional Interfaces
AC'97, DMA, GPIO, PCI
Graphics Acceleration
Yes
Operating Temperature
0°C ~ 85°C (TC)
Supplier Device Package
352-EBGA (35x35)
Number of Cores/Bus Width
1 Core
Display & Interface Controllers
LCD
| Attribute | Value |
|---|---|
| USB | USB (2) |
| SATA | - |
| Speed | 233MHz |
| Series | - |
| Ethernet | - |
| Packaging | Bulk |
| Manufacturer | Advanced Micro Devices |
| Mounting Type | Surface Mount |
| Voltage - I/O | 3.3V |
| Core Processor | AMD Geode™ GX1 |
| Package / Case | 352-BGA Exposed Pad |
| RAM Controllers | - |
| Co-Processors/DSP | - |
| Security Features | - |
| Additional Interfaces | AC'97, DMA, GPIO, PCI |
| Graphics Acceleration | Yes |
| Operating Temperature | 0°C ~ 85°C (TC) |
| Supplier Device Package | 352-EBGA (35x35) |
| Number of Cores/Bus Width | 1 Core |
| Display & Interface Controllers | LCD |
Purchase & Inquiry
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Important Notes
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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.
Packaging Process
Step2: Vacuum Packaging
Step3: Anti-Static Bag
Step4: Package Boxes
Step5: Bar-Code Shipping Tags
Step6: Shipping
